Abstract: Microencapsulated materials should be strong enough to withstand harsh conditions such as high temperature, high pressure and mechanical mixing, which were often neglected during the design process. In this review several common high-temperature microcapsules that could work well under high temperature conditions were introduced. Problems of encapsulating the core materials with different shell materials were identified, such as their compatibility and release of core materials. Composite wall microcapsules were introduced in detail, the heat resistance mechanism of nanocomposites was summarized, and the research methods of heat resistance mechanism were described. It can be concluded that the addition of inorganic nanomaterials affected the molecular chain or other aspects, thus improving the heat resistance of matrix materials. The defects of microcapsules in the field of heat resistance application were examined and the future development was prospected.