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鲁青, 邹军, 石明明, 朱雨轩, 陈跃, 翟鑫梦, 陈俊峰, 杨磊, 杨忠, 徐慧. 倒装LED芯片共晶焊接性能研究[J]. 应用技术学报, 2020, 20(4): 315-322. DOI: 10.3969/j.issn.2096-3424.2020.04.002
引用本文: 鲁青, 邹军, 石明明, 朱雨轩, 陈跃, 翟鑫梦, 陈俊峰, 杨磊, 杨忠, 徐慧. 倒装LED芯片共晶焊接性能研究[J]. 应用技术学报, 2020, 20(4): 315-322. DOI: 10.3969/j.issn.2096-3424.2020.04.002
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LU Qing, ZOU Jun, SHI Mingming, ZHU Yuxuan, CHEN Yue, ZHAI Xinmeng, CHEN Junfeng, YANG Lei, YANG Zhong, XU Hui. Research of Eutectic Soldering Performance of Flip Chip LED[J]. Journal of Technology, 2020, 20(4): 315-322. DOI: 10.3969/j.issn.2096-3424.2020.04.002
Citation: LU Qing, ZOU Jun, SHI Mingming, ZHU Yuxuan, CHEN Yue, ZHAI Xinmeng, CHEN Junfeng, YANG Lei, YANG Zhong, XU Hui. Research of Eutectic Soldering Performance of Flip Chip LED[J]. Journal of Technology, 2020, 20(4): 315-322. DOI: 10.3969/j.issn.2096-3424.2020.04.002
shu

倒装LED芯片共晶焊接性能研究

Research of Eutectic Soldering Performance of Flip Chip LED

    摘要
  • 摘要: LED照明与传统照明相比，具有节约能源、辐射小、使用寿命长、显色指数高等优点。当前LED倒装封装过程中，主要采用2种方法将芯片贴装到基板上，一种是通过导电银胶粘接，一种是进行共晶焊接。共晶焊接相比导电胶具有更高的可靠性，但关于其性能改善的研究还比较少。从共晶焊料、共晶焊接技术、共晶焊接可靠性等方面，综述了当前LED芯片共晶焊接的研究进展，以及未来的研究重点。

     

    Abstract: Compared with traditional lighting, LED lighting has various advantages of energy saving, small radiation, long service life, and high color rendering index, etc. In the current LED flip-chip packaging process, two methods are mainly used to mount the chip to the substrate, one is through conductive silver glue for bonding, and the other is eutectic soldering. The reliability of eutectic welding technology is higher than that of the conductive adhesives, however, there are few studies on the improvement of its performance. The current research progress of eutectic soldering of LED chips and the focus of future research were reviewed in terms of eutectic solder, eutectic soldering technology, and eutectic soldering reliability.

     

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