Abstract: Photosensitive dry film, also known as dry film photoresist, is a solid negative photoresist, which serves as an important raw material for the production of printed circuit board (PCB), and has huge market potential. With the increasing demand for precision and miniaturization of electronic products, the traditional pattern transfer technology for the production of PCB cannot meet the production demand; Laser direct imaging (LDI) finds its wide application in the production of photosensitive dry film due to its high precision. The research progress of photosensitive dry film related technologies was reviewed in terms of its performance, characteristics, the technical barriers, development status and application field, etc., so as to provide theoretical reference for workers in related industries.