Abstract: Due to its excellent physical properties, silicon carbide has gradually become a research hotspot in power semiconductor technology. However, the packaging of its power devices is problematic on account of high junction temperature, high thermal conductivity and stability at high temperatures. The low temperature resistance, thermal conductivity and high thermal expansion coefficient of ordinary packaging adhesives cannot meet the requirements for packaging of silicon carbide devices. How to improve the temperature resistance and thermal conductivity of encapsulation adhesive and reduce its thermal expansion coefficient is the focus of research. The encapsulation adhesive prepared with temperature resistant epoxy resin and temperature resistant dapsone curing agent and spherical and flaky aluminum oxide as thermal conductive filler shows low thermal expansion coefficient, high thermal conductivity and T_g after curing, which provides an insight into silicon carbide device packaging materials.