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WANG Wei, ZOU Jun, ZHANG Canyun, SHI Mingming, YANG Bobo, WANG Liping, LIU Yiming. Thermal Management Analysis Method of LED Devices and Its Application[J]. Journal of Technology, 2019, 19(1): 52-59,83. DOI: 10.3969/j.issn.2096-3424.2019.01.007
Citation: WANG Wei, ZOU Jun, ZHANG Canyun, SHI Mingming, YANG Bobo, WANG Liping, LIU Yiming. Thermal Management Analysis Method of LED Devices and Its Application[J]. Journal of Technology, 2019, 19(1): 52-59,83. DOI: 10.3969/j.issn.2096-3424.2019.01.007

Thermal Management Analysis Method of LED Devices and Its Application

  • Light-emitting diodes (LEDs) are sandwiches of semiconductor materials. LED chips are the core and functional part that produce light and heat, but the accumulated heat negatively influences optical properties of LEDs. Thus thermal management plays an important role in LEDs packaging and applications. It can be seen that there exist a great number of heat troubles from this review. In order to further understand the thermal management, LED packaging, thermal resistance network system and heat transfer enhancement technology were systematically introduced. Effective temperature control was achieved by reducing the thermal resistance.
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